1. Gheorghe Pascariu, Peter Cronin, Daniel Crowley Mrsi, Next Generation Electronics Packaging Utilizing Flip Chip Technology, in: 2003 IEEE/CPMT/ISEMI lnT Electronics Manufacturing Technolcgy Sympsium, 2003.
2. Solder Joint Technology: Materials, Properties and Reliability, Vol. 92;Tu,2007
3. Olivier Gaillard, Board level reliability testing of hermetic packages equipped with high-rel interconnection solutions and dedicated to space applications, in: 2013 Eurpoean Microelectronics Packaging Conference, EMPC, 2013, pp. 1–8.
4. Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions;Depiver;Eng. Fail. Anal.,2021
5. Mechanics of solder alloy interconnects;Frear,1994