Author:
Deyine A.,Doche E.,Battistella F.,Banc C.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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1. Integrating NI LabVIEW in Soft Defect Localization of Temperature Dependent Voltage Failure;2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA);2019-07