A methodological approach for predictive reliability: Practical case studies-Reference-Cited by-同舟云学术

A methodological approach for predictive reliability: Practical case studies

Published:2012-12 Issue:12 Volume:52 Page:3035-3042
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Frémont H.,Duchamp G.,Gracia A.,Verdier F.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

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3. Frémont H, How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies. In: Proceedings of the 11th EuroSimE; 2010 [chapter 19].

4. Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill;Tee;Microelectron Reliab,2003

5. Feng W, Frémont H, Guédon-Gracia A, Verdier F, Plano B. Analytical model for thermally-induced warpage of PoP. In: Proceedings of EuroSimE; 2008.

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