Author:
Tomas Ariane,Marechal Laurent,Almeida Rodrigo,Neffati Mehdy,Malbert Nathalie,Fremont Helene,Labat Nathalie,Garnier Arnaud
Funder
ECSEL Joint Undertaking (JU)
Cited by
4 articles.
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1. Evaluation of warpage of FOWLP considering the viscoelastic and viscoplastic properties of Epoxy Molding Compound;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Epoxy Mold Compound Characterization for Modeling Packaging Reliability;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25