Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method-Reference-Cited by-同舟云学术

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method

Published:2012-06 Issue:6 Volume:52 Page:1143-1152
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lau Chun-Sean,Abdullah M.Z.,Che Ani F.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

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4. Shen L, Wang M, He Y, Lam Tim F, Jiang Yu Q. Reflow profile simulation by finite element method for a BGA package. In: Electronic packaging technology, 2005 6th international conference on, 30 August–2 September 2005. p. 419–22.

5. Inoue M, Koyanagawa T. Thermal simulation for predicting substrate temperature during reflow soldering process. In: Proceedings of 55th electronic components and technology conference; 31 May–3 June 2005. vol. 1. p. 1021–6.

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