Author:
Gershman I.,Bernstein J.B.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Tulkoff C. Manufacturing and reliability challenges with QFN. CTEA (SMTA/IMAPS) Austin Expo & Tech, Forum; October, 2009.
2. Tee TY, Ng HS, Diot JL, Frezza G, Tiziani R, Santospirito G. Comprehensive design analysis of QFN and PowerQFN packages for enhanced board level solder joint reliability. In: 2002 Electronic components and technology conference.
3. Reliability of lead-free solder joints under a wide range of thermal cycling conditions;Ma;IEEE Trans Compon Pack Manufact Technol,2011
4. Gu J, Pecht M. Prognostics and Health management using physics-of-failure. In: Reliability and maintainability, symposium; 2008. p. 481–7.
5. Prognostics and health management of electronic packaging;Lall;IEEE Trans Compon Pack Technol,2006
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