Author:
Lu Hua,Shi Helen,Zhou Ming
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Review and analysis of lead-free solder material properties;Clech,2003
2. Plumbridge WJ. In: Suganuma K, editor. Mechanical evaluation in electronics lead-free soldering in electronics, 2004 [chapter 6].
3. Clech, JP. Lead-Free and mixed assembly solder joint reliability trends. IPC printed circuits Expo SMEMA council APEX designers summit’04, Anaheim, CA, March 24–26, 2004, p. S28-3-1–14.
4. Characterization of lead-free solders in flip chip joints;Wiese;ASME J Electron Packag,2003
5. Lau J, Dauksher W, Vianco P. Acceleration models, constitutive equations, and reliability of lead-free solders and joints. In: Proceedings of 2003 electronic components and technology conference, 2003, p. 229–36.
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