Author:
Dehbi A.,Ousten Y.,Danto Y.,Wondrak W.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference3 articles.
1. A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load;Li;Transactions of the ASME,2001
2. Toshiyuki Hamano. Destruction Mechanisms resulting from Vibration Load in PCB-mounted electronics. ESPEC Technology report No. 17.
3. Dave S. Steinberg: Vibration analysis for electronic equipment. ISBN 0-471-37685-X.
Cited by
13 articles.
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