1. T. Wong, F. Palmieri, H. Fenger, Under-filled BGA solder joint vibration fatigue damage, in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No. 02CH37258) (IEEE, 2002), pp. 961–966
2. T. Wong, F. Palmieri, B. Reed, H. Fenger, H. Cohen, K. Teshiba, Durability/reliability of BGA solder joints under vibration environment, in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No. 00CH37070) (IEEE, 2000), pp. 1083–1088
3. T. Wong, B. Reed, H. Cohen, D. Chu, Development of BGA solder joint vibration fatigue life prediction model, in 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No. 99CH36299) (IEEE, 1999), pp. 149–154
4. S.S. Manson, Fatigue-a complex subject-some simple approximations. Exp. Mech. 5(4), 193–226 (1965). https://doi.org/10.1007/BF02321056
5. V. Tan, M. Tong, K.M. Lim, C.T. Lim, Finite element modeling of electronic packages subjected to drop impact. IEEE Trans. Compon. Packag. Technol. 28(3), 555–560 (2005)