Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Darveaux R, Norton L, Carney F. Temperature dependent mechanical behavior of plastic packaging materials. In: Proceedings of the 45th Electronic Components and Technology Conference, Las Vegas, NV, USA; 1995. p. 1054–8.
2. Thermal stress in semiconductor encapsulating materials;van den Bogert;IEEE Trans Components, Hybrids, Manufacturing Technol,1988
3. Elastic and viscoelastic analysis of stress in thin films;Liu;J Appl Phys,1992
4. Finite element viscoelastic analysis of temperature and moisture effects in electronic packaging;Krishna;J Electron Pack ASME,1995
5. The evolution of residual stress in thermoplastic bonding to metal;Ramani;Int J Adhesion Adhesives,1997
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