Author:
Jiun Hoh Huey,Ahmad Ibrahim,Jalar Azman,Omar Ghazali
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Moore’s law: the next dimension;Savastiouk;Adv Packag,1998
2. Grief MK, Steele Jr JA. Warpage and mechanical strength studies of ultra thin 150mm wafers. In: IEEE/CPMT international manufacturing technology symposium; 1996. p. 190–4.
3. Landesberger C, Klink G, Schwinn G, Aschenbrenner R. New dicing and thinning concept improves mechanical reliability of ultra thin silicon. In: International symposium on advanced packaging materials; 2001. p. 92–7.
4. Gaulhofer E, Oyrer H. Wafer thinning and strength enhancement to meet emerging packaging requirements. In: IEMT Europe symposium; 2000. p. 1–4.
5. Draney NR, Liu JJ, Jiang T. Experimental investigation of bare silicon wafer warp. Microelectronics and electron devices. 2004 IEEE Workshop. p. 120–3.
Cited by
33 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献