1. Sengupta K, Sundahl R, Kawashima S, Arellano R, Sklenicka C, Thompson D. Packaging requirements and solutions for CMOS imaging sensors. in: Proceedings of IEEE/CPMT international electronics manufacturing technology symposium; 1998. p. 194–8.
2. A CMOS image sensor module applied for a digital still camera utilizing the TAB on glass (TOG) bonding method;Segawa;IEEE Trans Adv Pack,1999
3. Flip-chip interconnection method applied to small camera module;Karasawa;IEEE/ECTC,2001
4. Flip-chip packaging solution for CMOS image sensor device;Kim;Microelectron Reliab,2004
5. Watanabe I, Fujinawa T, Arifuku M, Fujii M, Gotoh Y. Recent advances of interconnection technologies using anisotropic conductive films in flat panel display applications. vol. 9. in: 9th International symposium on advanced packaging materials; 2004. p. 11–6.