Flip-chip packaging solution for CMOS image sensor device-Reference-Cited by-同舟云学术

Flip-chip packaging solution for CMOS image sensor device

Published:2004-01 Issue:1 Volume:44 Page:155-161
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kim Jong-heon,Kang In-Soo,Song Chi-jung,Hur Young-Jik,Kim Hak-Nam,Baek Esdy,Seo Tae-Jun

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

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4. Advanced low cost bare die packaging technology for liquid display;Hwang;IEEE Trans. CPMT A,1995

5. Overview of conductive adhesive interconnection technologies for LCDs;Kristiansen;IEEE Trans. CPMT A,1998

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