Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding-Reference-Cited by-同舟云学术

Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding

Published:2017-06 Issue: Volume:73 Page:60-68
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Laor Ari,Athia Depayne,Rezvani Alireza,Clauberg Horst,Mayer Michael

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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1. Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects;Ebersberger,2008

2. High reliability packaging technologies and process for ultra low k Flip Chip devices;Park,2015

3. 14nm chip package interaction development with Cu pillar bump flip chip package;Kuo,2015

4. Advanced thermocompression flip chip bonding;Clauberg,2014

5. High productivity thermocompression flip chip bonding;Clauberg,2015

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2. Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding;Soldering & Surface Mount Technology;2019-09-02

3. Integrated RTD Sensors for Maintaining Thermal Uniformity During TCB Process;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

4. Materials Merging Mechanism of Microfluidic Electroless Interconnection Process;Journal of The Electrochemical Society;2018