Optimal design of thermo-compression bonder via ANN-based surrogate modeling under uncertainty-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Optimal design of thermo-compression bonder via ANN-based surrogate modeling under uncertainty

Published:2023-03-04 Issue:3 Volume:34 Page:237-253
ISSN:0954-4828
Container-title:Journal of Engineering Design
language:en
Short-container-title:Journal of Engineering Design

Author:

Hwang Sungkun¹,Lee Sang Won²,Choi Hae-Jin³,Choi Seung-Kyum¹^ORCID

Affiliation:

1. George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. School of Mechanical Engineering, Sungkyunkwan University, Suwon, Korea

3. School of Mechanical Engineering, Chung-Ang University, Seoul, Korea

Publisher

Informa UK Limited

Subject

General Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/09544828.2023.2191242

Reference32 articles.

1. State-of-the-art in artificial neural network applications: A survey

2. Managing computational complexity using surrogate models: a critical review

3. Recent Progress in Materials Chemistry to Advance Flexible Bioelectronics in Medicine

4. Interface and Reliability Analysis of Au-Passivated Cu–Cu Fine-Pitch Thermocompression Bonding for 3-D IC Applications

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Multi-objective constrained robust design of a metamaterial vibration isolator with a limited budget;Journal of Engineering Design;2024-01-23

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3