Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method-Reference-Cited by-同舟云学术

Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method

Published:2017-11 Issue: Volume:78 Page:319-330
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wei Hsiu-Ping,Han Bongtae^ORCID,Youn Byeng D.,Shin Hyuk,Kim Ilho,Moon Hojeong

Funder

Samsung Electronics

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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5. Robust Engineering Design-by-reliability With Emphasis on Mechanical Components & Structural Reliability;Kececioglu,2003

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