Durability distribution prediction of thermo-mechanical solder fatigue failure with uncertainty propagation by eigenvector dimension reduction method-Reference-Cited by-同舟云学术

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Durability distribution prediction of thermo-mechanical solder fatigue failure with uncertainty propagation by eigenvector dimension reduction method

Published:2024-10 Issue: Volume:161 Page:115453
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Huang Chien-Ming,Herrmann Jeffrey W.

Publisher

Elsevier BV

Reference32 articles.

1. Thermal management on IGBT power electronic devices and modules;Qian;IEEE Access,2018

2. Power semiconductor devices and packages: solder mechanical characterization and lifetime prediction;Calabretta;IEEE Access,2021

3. Durability Distribution Analysis of Lead-Free Solder Joints for Printed Circuit Board Applications. Dissertation;Huang,2023

4. Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life;Chen;Microelectron. Reliab.,2020

5. Durability of lead-free solder interconnections for printed circuit board applications: comparing energy-based thermo-mechanical fatigue models;Huang,2023

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