Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation-Reference-Cited by-同舟云学术

Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation

Published:2017-09 Issue: Volume:76-77 Page:601-605
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Magnien J.,Mitterhuber L.,Rosc J.,Schrank F.,Hörth S.,Goullon L.,Hutter M.,Defregger S.,Kraker E.

Funder

Bundesministerium für Verkehr, Innovation und Technologie

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

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2. Approaches for high internal quantum efficiency green InGaN light-emitting diodes with large overlap quantum wells;Zhao;Opt. Express,2011

3. Thermal and mechanical effects of voids within flip chip soldering in LED packages;Liu;Microelectron. Reliab.,2014

4. Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations;Elger;Microelectron. J.,2015

5. Thermal Management for LED Applications;Lasance,2014

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