Author:
Chen F.,Bravo O.,Harmon D.,Shinosky M.,Aitken J.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Chen F, Chanda K, Gill J, Angyal M, Demarest J, Sullivan T, et al. In: Proceeding of the 43rd annual reliability of physics symposium; 2005. p. 501–7.
2. Ogawa ET, Kim J, Haase GS, Mogul HC, McPherson JW. In: Proceeding of the 41st annual reliability of physics symposium; 2003. p. 166–72.
3. Chen F, Lloyd J, Chanda K, Achanta R, Bravo O, Strong A, et al. In: Proceeding of the 46th annual reliability of physics symposium; 2008. p. 132–7.
4. Dominant Factors in TDDB Degradation of Cu Interconnects
5. On the weibull shape factor of intrinsic breakdown of dielectric films and its accurate experimental determination-part I: theory, methodology, experimental techniques
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