Author:
Hu Yu-Qun,Zhao Ya-Pu,Yu Tongxi
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Stress control structures for microelectromechanical systems using structural mechanics approach;Krupenkin;Appl Phys Lett,2006
2. Room-temperature bonding of lithium niobate and silicon wafers by argon-beam surface activation;Takagi;Appl Phys Lett,1999
3. Waver bonding for silicon-on-insulator technologies;Lasky;Applied Physics Letters.,1986
4. Bonding of silicon wafers for silicon-on-insulator;Maszara;J Appl Phys,1988
5. Gösele U, Alexe M, Kopperschmidt P, Tong QY. Semiconductor wafer bonding – a flexible approach to materials combinations in microelectronics; micromechanics and optoelectronics. In: Cas’97 proceedings of the 1997 international semiconductor conference, 20th ed., vols. 1 and 2. New York: IEEE; 1997. p. 23–32.
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献