Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics

Author:

Ekpu Mathias,Bhatti Raj,Okereke Michael I.,Mallik Sabuj,Otiaba Kenny

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

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2. Ekpu M, Bhatti R, Ekere NN, Mallik S, Amalu E, Otiaba KC. Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE international conference on adaptive science and technology, Abuja, Nigeria, 24–26 November, 2011. p. 127–132.

3. Analytical and numerical studies on microscale heat sinks for electronic applications;Kulkarni;Appl Thermal Eng,2005

4. Comparison of transient and static test methods for chip-to-sink thermal interface characterization;Smith;Microelectron J,2009

5. Ekpu M, Bhatti R, Ekere N, Mallik S, Otiaba KC. Effect of thermal interface materials (solders) on thermal performance of a microelectronic package. In: IEEE international symposium on design, test, integration, and packaging of MEMS/MOEMS. Cannes Cote d’ Azur, France, 25–27 April, 2012. p. 154–9.

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