Author:
Ekpu Mathias,Bhatti Raj,Okereke Michael I.,Mallik Sabuj,Otiaba Kenny
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Manivannan S, Devi SP, Arumugam R. Optimization of flat plate heat sink using genetic algorithm. In: IEEE international conference on electrical energy systems (ICEES), 2001. p. 78–81.
2. Ekpu M, Bhatti R, Ekere NN, Mallik S, Amalu E, Otiaba KC. Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE international conference on adaptive science and technology, Abuja, Nigeria, 24–26 November, 2011. p. 127–132.
3. Analytical and numerical studies on microscale heat sinks for electronic applications;Kulkarni;Appl Thermal Eng,2005
4. Comparison of transient and static test methods for chip-to-sink thermal interface characterization;Smith;Microelectron J,2009
5. Ekpu M, Bhatti R, Ekere N, Mallik S, Otiaba KC. Effect of thermal interface materials (solders) on thermal performance of a microelectronic package. In: IEEE international symposium on design, test, integration, and packaging of MEMS/MOEMS. Cannes Cote d’ Azur, France, 25–27 April, 2012. p. 154–9.
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献