Comparison of transient and static test methods for chip-to-sink thermal interface characterization-Reference-Cited by-同舟云学术

Comparison of transient and static test methods for chip-to-sink thermal interface characterization

Published:2009-09 Issue:9 Volume:40 Page:1379-1386
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Smith B.,Brunschwiler T.,Michel B.

Publisher

Elsevier BV

Subject

General Engineering

Reference30 articles.

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