Funder
National Science Foundation
U.S. Department of Energy Partnership on Thermoelectrics for Automotive Waste Heat Recovery
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference23 articles.
1. Performance and testing of thermal interface materials;Gwinn;Microelectron. J.,2003
2. Thermal interface materials: historical perspective, status, and future directions;Prasher;Proc. IEEE,2006
3. S. Glasgow, K. Kittredge, Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions. 2003.
4. F. Sarvar, D.C. Whalley, P.P. Conway, Thermal interface materials – a review of the state of the art, In: Electronics Systemintegration Technology Conference, 2006. 1st. IEEE, 2006.
5. S. Narumanchi et al. Thermal interface materials for power electronics applications, in: 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. IEEE, 2008.
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