Author:
Roh Myong-Hoon,Jung Jae Pil,Kim Wonjoong
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference35 articles.
1. International Technology Roadmap for Semiconductors; 2010 .
2. Sakuma K, Andry PS, Kang B, Maria J, Tsang CK, Patel C, et al. 3D Chip stacking technology with low-volume lead-free interconnections. In: Proceedings of 57th electronic components and technology conference; 2007. p. 627–32.
3. Hwang J, Kim J, Kwon W, Kang U, Cho T, Kang S. Fine pitch chip interconnection technology for 3D integration. In: Proceedings of 60th electronic components and technology conference; 2010. p. 1399–03.
4. Effect of under bump metallization (UBM) on interfacial reaction and shear strength of electroplated pure tin solder bump;Kim;J Kor Inst Met Mater,2008
5. Electrodeposition and characterization of Sn–Ag–Cu solder alloys for flip-chip interconnection;Qin;Electrochim Acta,2010
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