High temperature physical modeling and verification of a novel 4H-SiC lateral JFET structure

Author:

Zhong Xueqian,Zhang Li,Xie Gang,Guo Qing,Wang Tao,Sheng Kuang

Funder

Zhejiang Provincial Natural Science Foundation of China for Distinguished Young Scholars

Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Bhatnagar M, Baliga BJ. Analysis of silicon carbide power device performance. In: Proceedings of the 3rd international symposium on power semiconductor devices and ICs, ISPSD ’91; 22–24 April 1991. p. 176–180.

2. 1200V High-side lateral MOSEFET in junction-isolated power IC technology using two field-reduction layers;Ajit;Power Semicond Dev ICs,1993

3. 2.6kV 4H-SiC lateral DMOSFET’s;Spitz;IEEE Electron Dev Lett,1998

4. Lateral N-channel inversion mode 4H-SiC MOSFETs;Scridevan;IEEE Electron Device Lett,1998

5. A new 800V lateral MOSFET with dual conduction paths;Disney;Power Semicond Dev ICs,2001

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