Author:
Stoyanov Stoyan,Bailey Chris,Alam M.O.,Yin Chunyan,Best Chris,Tollafield Peter,Crawford Rob,Parker Mike,Scott Jim
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. European Union, Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste of electrical and electronic equipment, Official Journal of the European Union, February 13; 2003. p. L37/24-L37/38.
2. European Union, Directive 2002/95/EC/ of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, Official Journal of the European Union, February 13; 2003. p. L37/19-L37/23.
3. The impact of lead-free legislation exemptions on the electronics industry;Pecht;IEEE Trans Electron Pack Manuf,2004
4. Condra LW et al. The challenge of lead-free electronics for aerospace electronics systems. In: Proceedings of IEEE 2009 custom integrated circuits conferences (CICC), San Jose, California USA, October 2009. p. 1–8.
5. Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling;Nakadaira;Microelectron Reliab,2008
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献