Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect-Reference-Cited by-同舟云学术

Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect

Published:2006-09 Issue:9-11 Volume:46 Page:1652-1656
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Roy Arijit,Tan Cher Ming

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Blech IA, Sello H. A study of failure mechanisms in silicon planar epitaxial transistors. In: Shilliday TS, Vaccaro J. editors. Physics of failure in Electronics. Rome Air Development Ctr., 5 (1966) 496–505.

2. Electromigration reliability issues in dual-damascene Cu interconnects;Ogawa;IEEE Trans Relia,2002

3. Investigation of the effect of temperature and stress gradient on aceelerated EM test for Cu narrow interconnects;Tan;Thin Solid Films,2006

4. Current Crowding Effect on Copper Dual Damascene Via Bottom Failure for ULSI Applications;Tan;IEEE Trans Device and Materials Relia,2005

5. Dynamic study of the physical processes in the intrinsic line electromigration deep submicron copper and aluminum interconnects;Tan;IEEE Tans Device and Materials Relia,2004

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interconnect reliability investigation for a high power GaN MMIC PA based on APDL;International Journal of RF and Microwave Computer-Aided Engineering;2022-11-16

2. 3D Electromigration Modelling for VLSI;2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT);2022-10-25

3. Design and Electromigration Study for a Stacked Distributed Power Amplifier;Journal of Circuits, Systems and Computers;2020-11-20

4. High-efficiency Elecmigration Analysis for RF Switch Using AMG;2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2020-09-20

5. Study of complete interconnect reliability for a GaAs MMIC power amplifier;International Journal of Electronics;2017-11-29