Creep of thermally aged SnAgCu-solder joints

Author:

Wiese S.,Wolter K.-J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Stromswold EI. Characterization of eutectic tin–silver solder joints. Dissertation, University of Rochester; 1993.

2. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn–Ag/Cu solder joints;Yang;J Electron Mater,1995

3. Lotpasten für das Reflowlöten – Erhöhte Zuverlässigkeit durch Ge-fügedesign;Berek;VTE – Aufbau und Verbindungstechnik in der Elektronik,2003

4. Creep deformation of Sn–3.5Ag-solder/Cu couple at small length scales;Kerr;Acta Mater,2004

5. Morris Jr JW, Song HG, Hua F. Creep properties of Sn-rich solder joints. In: Proceedings of the IEEE 53rd electronics components and technology conference, New Orleans; May 27–30. p. 54.

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