Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition-Reference-Cited by-同舟云学术

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition

Published:2007-12 Issue:12 Volume:47 Page:2188-2196
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Yeh Chang-Lin,Tsai Tsung-Yueh,Lai Yi-Shao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. JEDEC Solid State Technology Association, JESD22-B110: Subassembly Mechanical Shock, 2001.

2. JEDEC Solid State Technology Association, JESD22-B111: Board Level Drop Test Method of Component for Handheld Electronics Products, 2003.

3. Wong EH, Lim KM, Lee N, Seah S, Hoe C, Wang J, “Drop impact test—mechanics and physics of failure”. In: Proceedings of the 4th electronics packaging technology conference, Singapore, 2002. p. 327–33.

4. Xu L, Wang J, Reinikainen T, Han ZX, Wang BP, “Numerical studies of the mechanical response of solder joint to drop/impact load”. In: Proceedings of the 5th electronics packaging technology conference, Singapore, 2003. p. 228–32.

5. Luan J-E, Tee TY, Pek E, Lim CT, Zhong Z, “Modal analysis and dynamic responses of board level drop test”. In: Proceedings of the 5th electronics packaging technology conference, Singapore, 2003. p. 233–43.

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel high-performance piezoresistive shock accelerometer for ultra-high-g measurement utilizing self-support sensing beams;Review of Scientific Instruments;2020-08-01

2. Finite element model updating of board-level electronic packages by factorial analysis and modal measurements;Microelectronics International;2018-04-03

3. Removal of CrMo alloy steel components from investment casting gating system using vibration-excited fatigue failure;The International Journal of Advanced Manufacturing Technology;2016-06-24

4. Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections Under JEDEC Standard Drop Test;Journal of Electronic Materials;2013-07-11

5. Efficient multi-level modeling technique for determining effective board drop reliability of PCB assembly;Microelectronics Reliability;2013-07