Author:
Takaishi J.,Harada S.,Tsukuda M.,Omura I.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
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4. Seto K, Imaki H, Takaishi J, Tanaka M, Tsukuda M. Omura I. Sub-micron junction termination for 1200V class devices toward CMOS process compatibility. In: Proc. of 25th international symposium on power semiconductor devices & IC’s(ISPSD), 2013. p. 281–4.
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