Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Yoon S, Han B, Cho S, Jang C. Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses. In: Proceedings of Pacific Rim/ASME international electronic packaging technical conference and exhibition, IPACK Paper, No. 2005-73427; 2005.
2. Gasperi ML. Life prediction model for aluminum electrolytic capacitors. In: Industry applications conference, 1996. Thirty-first IAS annual meeting. IAS ‘96. Conference record of the 1996 IEEE, vol. 3; 1996. p. 1347–51 . doi:10.1109/IAS.1996.559241.
3. Hsu H-C, Hsu Y-T, Hsieh W-L, Weng M-C, ZhangJian S-T, Hsu F-J, Chen Y-F, Fu -L. Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package. Proc., 3rd Intl. Conf. on Microsystem, Packaging, Assembly & Circuits Technology, IMPACT2008, Taipei, Taiwan, October 22–24, 008, 291–294. http://dx.doi.org/10.1109/IMPACT.2008.4783868.
4. Linear analysis of field problems;Madenci,2006
5. Standard test method for water absorption of plastics. Designation: D 570-98. (reapproved 2005).
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