Author:
Chen Cheng-fu,Wu Sheng-Tsai
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Demystifying 3D ICs: the pros and cons of going vertical;Davis;IEEE T Design $ Test Comput,2005
2. Three-dimensional silicon integration;Knickerbocker;IBM J Res Dev,2008
3. Knickerbocker JU, Andry PS, Dang D, Horton RR, Patel CS, Polastre RJ et al. 3D silicon integration. In: 58th Electronic Components and Technology Conference, Lake BuenaVista (FL); 2008, p. 538–43.
4. Impact of 3D ICs with TSV is profound but complex and costly – is there a better way?;Tummala;Chip Scale Rev,2011
5. Thermal expansion coefficients of composites materials based on energy principles;Schapery;J Compos Mater,1968
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