A new creep fatigue model for solder joints-Reference-Cited by-同舟云学术

A new creep fatigue model for solder joints

Published:2019-07 Issue: Volume:98 Page:153-160
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wong E.H.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Creep-fatigue analysis by strain range partitioning;Manson,1971

2. Lifetime of structures subjected to varying load and temperature;Taira,1962

3. Palmgren AG: Die Lebensdauer von Kugellagern. Zeitschrift des Vereines Deutscher Ingenieure,1924

4. Effect of temperature variations on the creep strength of steels;Robison;Trans. ASME,1938

5. Uniaxial creep–rupture behaviour of low alloy steel under variable loading conditions;Goldhoff;J Basic Engng,1965

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