Creep lifetime prediction of solder joint for heat sink assembly-Reference-Cited by-同舟云学术

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Creep lifetime prediction of solder joint for heat sink assembly

Published:2010-09 Issue:9-11 Volume:50 Page:1645-1649
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Han Changwoon,Oh Chulmin,Park Nochang,Hong Wonsik

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Failure-mechanism models for creep and creep rupture

2. Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models

3. Han C, Park N, Oh C, Hong W, Song B. In: Prcd IMECE 2009-11129; 2009.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Load Sharing Between Discrete Solder Joints in Bending: Effect of Spacing and Joint Properties;IEEE Transactions on Device and Materials Reliability;2016-09

2. Effect of Solder Joint Length on Fracture Under Bending;Journal of Electronic Materials;2015-11-09

3. Creep failure mechanism and life prediction of lead-free solder joint;Journal of Materials Science: Materials in Electronics;2014-10-18

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