Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue-Reference-Cited by-同舟云学术

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue

Published:2018-04 Issue: Volume:83 Page:162-172
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Dudek R.,Hildebrand M.,Rzepka S.,Fries T.,Döring R.,Seiler B.,Ortmann R.W.

Funder

TRACE

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Enabling Smart Mobility and Smart Infrastructure by Development of a Technology ReAdiness Process for Consumer Electronics (TRACE),2015

2. MicroProf® 300 TL, FRT GmbH, www.frtmetrology.com.

3. Characterization of the thermo-mechanical deformation behaviour of composite materials for power electronics using Digital image correlation method microDAC®;Seiler,2013

4. Catrene Report on Technology Readiness Process for Consumer Electronics (TRACE),2017

5. Simulation based analysis of secondary effects on solder fatigue;Dudek;Microelectron. Reliab.,2009

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