Author:
Dudek Rainer,Doering Ralf,Bombach Christine,Michel Bernd
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference2 articles.
1. Dudek R, Walter H, Döring R, Michel, B. Thermal Fatigue Modelling for SnAgCu and SnPb Solder Joints. In: Proceedings EuroSimE 2004, Brussels, Belgium, May; 2004. p. 557–64.
2. Yuan Y. Computational material property simulation for laminated composites. In: ITherm conf proceedings 2006, San Diego, USA, May; 2006.
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2 articles.
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