Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment-Reference-Cited by-同舟云学术

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment

Published:2018-05 Issue: Volume:84 Page:197-207
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Manoharan Subramani,Patel Chandradip,McCluskey Patrick,Pecht Michael

Funder

CALCE

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Copper Wire Bonding. S.L.;Chauhan,2016

2. Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield;Harman,1997

3. Strength and reliability of high temperature transient liquid phase sintered joints;Moeini,2014

4. Reliability and failure analysis of Cu-Sn transient liquid phase sintered (TLPS) joints under power cycling loads;Moeini,2015

5. Advancements in silver wire bonding;Manoharan,2017

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