Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly-Reference-Cited by-同舟云学术

Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly

Published:2018-08 Issue: Volume:87 Page:125-132
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Meier Karsten,Metasch René,Roellig Mike,Bock Karlheinz

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

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2. Vibration reliability of SMD Pb-free solder joints;Borras,2010

3. Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration;Lall,2012

4. Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations;Libot,2016

5. Effect of environmental and testing conditions on board level vibration;Roucou,2016

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4. Investigation of the effects of temperature variations on Inertial Measurement Units for UAV;2022 IEEE 9th International Workshop on Metrology for AeroSpace (MetroAeroSpace);2022-06-27

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