A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

Author:

Fan JiajieORCID,Cao Jianwu,Yu Chaohua,Qian Cheng,Fan Xuejun,Zhang Guoqi

Funder

Natural Science Foundation of Jiangsu Province

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Postgraduate Research & Practice Innovation Program of Jiangsu Province

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Nonlinear dimming and correlated color temperature control of bicolor white LED systems;Chen;IEEE Trans. Power Electron.,2015

2. Precise dimming and color control of LED systems based on color mixing;Lee;IEEE Trans. Power Electron.,2016

3. LED Packaging 2016: Market, Technology and Industry Landscape Report;Y. Développement,2016

4. High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes;Huang;J. Photonics Energy,2015

5. Philips Lumileds: Chip Scale Packaging for LEDs;LEDinside,2013

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