High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes-Reference-Cited by-同舟云学术

High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

Published:2015-04-21 Issue:1 Volume:5 Page:057606
ISSN:1947-7988
Container-title:Journal of Photonics for Energy
language:en
Short-container-title:J. Photon. Energy

Author:

Huang Che-Hsuan¹,Chen Kuo-Ju¹,Tsai Ming-Ta²,Shih Min-Hsiung³,Sun Chia-Wei¹,Lee Wei-I²,Lin Chien-Chung⁴,Kuo Hao Chung¹

Affiliation:

1. National Chiao Tung University, Department of Photonics & Institute of Electro-Optical Engineering, 1001 University Road, Hsinchu 30010, Taiwan

2. National Chiao Tung University, Department of Photonics & Institute of Electro-Physics, 1001 University Road, Hsinchu 30010, Taiwan

3. National Chiao Tung University, Department of Photonics & Institute of Electro-Optical Engineering, 1001 University Road, Hsinchu 30010, TaiwancAcademia Sinica, Research Center for Applied Sciences, Nankang, Taipei 115, Taiwan

4. National Chiao Tung University, Institute of Photonics System, Tainan 711, Taiwan

Publisher

SPIE-Intl Soc Optical Eng

Subject

Renewable Energy, Sustainability and the Environment,Atomic and Molecular Physics, and Optics

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