Mechanism of wire bond shear testing-Reference-Cited by-同舟云学术

Mechanism of wire bond shear testing

Published:2018-09 Issue: Volume:88-90 Page:738-744
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Manoharan Subramani,Patel Chandradip,Hunter Stevan,McCluskey Patrick

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Failure mechanisms in encapsulated copper wire-bonded devices;Manoharan,2016

2. Comparsion of Au/Al and Cu/Al in wirebonding assembly and reliability;Lee,2011

3. The emergence of high volume copper ball bonding;Deley,2004

4. Copper wire bonding;Chauhan,2014

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1. Behavior of Different Ultrasonically Bonded Aluminum Heavy Wires in the Shear Test;Journal of Electronic Materials;2024-07-02

2. Copper Wire Bonding: A Review;Micromachines;2023-08-16

3. Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach;The International Journal of Advanced Manufacturing Technology;2022-11-05

4. Research on Optimal and Experimental Process Parameters for an Ultrasonic Wire Bonding System;2022 9th international Conference on Wireless Communication and Sensor Networks (ICWCSN);2022-01-11

5. Failure Analysis of Aluminum Wire Bonds in Automotive Pressure Sensors in Thermal Shock Environments;IEEE Access;2021