Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs-Reference-Cited by-同舟云学术

Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

Published:2018-08 Issue: Volume:87 Page:89-96
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Alexeev A.,Martin G.,Onushkin G.

Funder

European Union

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. Generic methodology for deriving compact dynamic thermal models, applied to the PSGA package;Christiaens;IEEE Trans. components, Packag. Manuf. Technol. Part A,1998

5. Fine structure of heat flow path in semiconductor devices: a measurement and identification method;Van Bien;Solid State Electron.,1988

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