Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. A review of board level solder joints for mobile applications;Wong;Microelectron. Reliab.,2008
2. Drop impact test-mechanics & physics of failure;Wong,2002
3. Comparison of modeling techniques for the vibration analysis of printed circuit cards;Pitarresi;J. Electron. Packag.,1992
4. Random vibration response of a surface mount lead/solder joint;Pitarresi;Adv. Electron. Packag.,1993
5. Modeling of printed circuit cards subject to vibration;Pitarresi,1990
Cited by
27 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献