Adhesion strength of die attach film for thin electronic package at elevated temperature-Reference-Cited by-同舟云学术

Adhesion strength of die attach film for thin electronic package at elevated temperature

Published:2018-12 Issue: Volume:91 Page:15-22
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Mose Bruno R.,Son In-Seo,Shin Dong-Kil

Funder

2016 Yeungnam University Research Grant

Ministry of Education

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Die attach adhesives and films;Takeda,2009

2. Micro- and Opto-electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Volume II Physical Design–Reliability and Packaging;Suhir,2007

3. Adhesion Science and Engineering-1, the mechanics of Adhesion;Dillard,2002

4. On the effective constitutive properties of a thin adhesive layer loaded in peel;Andersson;Int. J. Fract.,2006

5. Effects of moisture absorption and temperature on the adhesion strength between die attach film (DAF) and silicon die;Guan,2012

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