Melamine–graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications-Reference-Cited by-同舟云学术

Melamine–graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications

Published:2022 Issue:40 Volume:14 Page:15193-15202
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Sun Zhijian¹^ORCID,Wong Ryan¹,Liu Yifan¹,Yu Michael¹^ORCID,Li Jiaxiong¹,Spence Daron¹,Zhang Mingyue¹,Kathaperumal Mohanalingam²,Wong Ching-Ping¹^ORCID

Affiliation:

1. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA

2. School of Electrical and Computing Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA

Abstract

With the fast development of personal portable electronic devices, it is important to explore new die attach film materials in the limited mounting area and height to meet the requirements of a high packaging density and a high operating speed.

Funder

National Science Foundation

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2022/NR/D2NR04557E

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