Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation-Reference-Cited by-同舟云学术

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Published:2018-06 Issue: Volume:85 Page:163-175
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wild P.,Lorenz D.^ORCID,Grözinger T.,Zimmermann A.

Funder

German Ministry of Economic Affairs and Energy

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference37 articles.

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2. Design and Assembly Process Implementation for BGAs;IPC-7095-C,2013

3. Teil 6: Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode;DIN EN 61191,2011

4. Acceptability of Electronic Assemblies;IPC-A-610E,2010

5. The last will and testament of the BGA void;Hillman,2011

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