Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks-Reference-Cited by-同舟云学术

Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks

Published:2022-02 Issue: Volume:129 Page:114461
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zippelius Andreas,Hanß Alexander,Schmid Maximilian,Pérez-Velázquez Judith,Elger Gordon

Funder

Bundesministerium für Bildung und Forschung

Bavarian State Ministry of Science Research and Art

Bayerisches Staatsministerium für Wissenschaft und Kunst

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

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2. Transient thermal analysis for accelerated reliability testing of leds;Elger;Microelectron. Reliab.,2016

3. Defect inspection of flip chip solder joints based on non-destructive methods: a review;Su;Microelectron. Reliab.,2020

4. Transient thermal analysis as in-situ method in accelerated stress tests to access package integrity of leds;Elger,2018

5. Light emitting diodes reliability review;Chang;Microelectron. Reliab.,2012

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4. Temperature and current density prediction in solder joints using artificial neural network method;Soldering & Surface Mount Technology;2023-12-04

5. Thermographic, Electric, and Spectral Measurements for Analysis of High-Power LEDs;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27