Author:
Zhang Junjun,Liu Fanyu,Li Bo,Huang Yang,Yang Can,Wang Guoqing,Chen Siyuan,Cheng Jinxing,Wang Qingbo,Yu Ai,Luo Jiajun
Funder
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit;Andrieu;Int. Conf. IC Des. Technol.,2018
2. Semicond. Ind. Assoc., San Jose, CA, USA,2020
3. Heterogeneous Integration Roadmap (HIR): Co-design Challenges and Perspectives;Aida,2019
4. The effect of layout topology on single-event transient pulse quenching in a 65 nm bulk CMOS process;Ahlbin;IEEE Trans. Nucl. Sci.,2010
5. New insights into single event transient propagation in chains of inverters–evidence for propagation-induced pulse broadening;Ferlet;IEEE Trans. Nucl. Sci.,2007
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