Power cycling failure analysis of double side cooled IGBT modules for automotive applications-Reference-Cited by-同舟云学术

Power cycling failure analysis of double side cooled IGBT modules for automotive applications

Published:2021-09 Issue: Volume:124 Page:114282
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ma Yaqing,Li Jianfeng,Dong Fangfang,Yu Jun

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Packaging technology of power module for automotive applications;Shimozuma,2017

2. Novel silicon carbide integrated power module for EV application;Mouawad,2018

3. Automotive power module packaging: current status and future trends;Yang,2020

4. Britain to ban sale of all diesel and petrol cars and vans from 2040 https://www.theguardian.com/politics/2017/jul/25/britain-to-ban-sale-of-all-diesel-and-petrol-cars-and-vans-from-2040.

5. SiC and GAN devices – competition or coexistence?;Kaminski,2012

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on the optimal width and optimal life value of IGBT unilateral local lifetime control;IEICE Electronics Express;2024-09-10

2. Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliability;Microelectronic Engineering;2024-08

3. Superjunction IGBT with split carrier storage layer;Semiconductor Science and Technology;2024-05-28

4. Thermomechanical Stress Analysis, Characterization, and Optimization for Double-Side Cooled Power Modules With Ceramic Substrate;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

5. Analysis and Design Optimization of Tilted Rounded-Rectangular Pin-Fins Heat Sink for xEV Double-Sided Cooling Power Module;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-04