Characterization of plastic and creep behavior in thick aluminum wire for power modules-Reference-Cited by-同舟云学术

Characterization of plastic and creep behavior in thick aluminum wire for power modules

Published:2021-08 Issue: Volume:123 Page:114185
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Shishido Nobuyuki,Setoguchi Yoshiki,Kumagai Yuto,Koganemaru Masaaki,Ikeda Toru,Hayama Yutaka,Miyazaki Noriyuki

Funder

Japan Society for the Promotion of Science

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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